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Nitronex snubbed by RFHIC's Cree switch

From:compoundsemiconductor.netKoreanvendorsaysitfavorsperformanceandreliabilityprovidedbySiCsubstratesoversiliconforGaNwirelesscomponents.RFHICsaysthatGaN-on-SiCdevicescanbecompetitivewithproductsmanufacturedonsiliconwafers,thankstoeconomiesofscaleof
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Nitronex snubbed by RFHIC's Cree switch

From:compoundsemiconductor.netKoreanvendorsaysitfavorsperformanceandreliabilityprovidedbySiCsubstratesoversiliconforGaNwirelesscomponents.RFHICsaysthatGaN-on-SiCdevicescanbecompetitivewithproductsmanufacturedonsiliconwafers,thankstoeconomiesofscaleof
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RFMD® Launches GaN Foundry Services 2009

RFMD®developsandmanufacturesunmatchedcompoundsemiconductortechnologiesandisnowofferingfoundryservicesforourindustry-leading0.5μmGaNonSiCprocess.RFMD’sworld-classmanufacturingscale,supportedbythelargestIII-Vfactoryintheworld,enablesbest-i
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Palm Pre teardown by Portelligent 2009-0

LookatthechipsinthePalmPre.WillitbeanotheriPhone?Bytheway,IreallylovetheiPone3GS,with600MHzAP,256MRAM,andOpenGLES2.0supportingbynewPowerVRSGXgraphicschip.
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手机射频系统厂家 2009-06-10

转载一篇。***手机射频系统有三个主要零组件,收发器(Transceivers)、功率放大器(PowerAmplifier,下简称PA)和天线开关,有时PA包含在前端模块(Front-End-Module,简称FEM)。2G时代的射频系统只占大约1.5美元的成本,3G时代则占大约6-8美元的成本,4G时代则占大约
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我的MMIC/RFIC知识结构 2009-06-07

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射频半导体工艺 2009-06-07

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学而不思 2009-06-06

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MMIC问答 6 2009-06-06

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MMIC问答 5 2009-06-06

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MMIC问答 4 2009-06-06

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MMIC问答 3 2009-06-06

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MMIC问答 2 2009-06-06

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MMIC问答 1 2009-06-05

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IMS2009 Technical Program to Highlight B